文献1(2014):Simulation of damage and failure processes of interpenetrating SiC/Al composites
subjected to dynamic compressive loading(动态压缩载荷作用下SiC/Al双连通复合材料损伤破坏过程仿真)
The crack initiation is generated both on the up and down sides of the SiC phase at t =
2.4μs.
Subsequently, the two cracks penetrate into the inner side of the SiC phase at t = 3.2μs,
thus
making the interface bear a higher tension stress. As the two cracks develop further, their
paths begin to deflect along the original interfaces at t = 3.6μs, accompanied by the
interface
debonding phenomenon. At t = 4.0μs, the degree of interface debonding further increases
until
the two cracks are completely connected to each other. It can be seen that, although brittle
fracture of the SiC ceramic phase plays a key role in crack initiation, the existence of complex
3-D SiC/Al interfaces usually causes the generated cracks to be deflected before connecting with
each other. This significantly retards the propagation of the cracks and thus increases the
ductility of the composite materials.
Fig.17. The process from crack initiation and propagation to “interface
debonding” in region A from.
In the final stage of failure (4.0-5.0μs), as shown in Fig. 18, there is an extensive region of
collapse in the SiC phase, but the Al phase still retains a certain structural integrity. Fig.
19 shows the effective plain strain contours of the Al phase at different times. To observe the
plastic deformation of the Al phase in 3-D space, the SiC phase is hidden. As shown in Fig.
19(a), there exists clear plastic deformation in the local, relatively narrow, regions in the Al
phase at t = 4.0μs. At t = 5.0μs (see Fig. 19(b)), local necking and tearing
fractures tend to
be localized in those severely deformed regions.
Fig.19. The failure contours of the 3-D FE model at t=5.0μs and the
effective
plain strain contours of Al at different times.
Simulation of damage and failure processes of interpenetrating SiC/Al composites subjected to
dynamic compressive loading
Acta Materialia 78 (2014) 190–202
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文献2(2014):Experimental observation and numerical simulation of SiC3D /Al
interpenetrating phase
composite material subjected to a three-point bending load(SiC3D /
Al双连通复合材料三点弯曲载荷的实验观察与数值模拟)
Both the experimental and simulation results indicated that crack propagation occurred
predominantly in the SiC phase, which is consistent with the general understanding that crack
propagation occurs in the brittle ceramic phase. The experimental test and the simulation were
consistent at the macroscopic scale, with both methods indicating that the primary crack was
roughly parallel to the loading direction.
Fig.6. Simulated crack growth path and micrograph showing primary crack in
SiC3D /Al composite.
Subsequently, the generated microcracks propagated and amalgamated at t= 23.65 s to form a
primary crack. The primary crack then propagated rapidly until the specimen ruptured. It was
noted that the crack was finally terminated at a SiC–Al interface due to the greater plasticity
of the Al phase that enabled it to deform at that point without cracking. Fig. 10(b) shows the
stress contours of the SiC3D/Al composite at t= 22.9 s, where it is seen that
a new stress concentration developed within the SiC above the Al phase, such that the primary
crack bridged over the Al phase, then continued to propagate within the SiC ceramic material.
Fig. 10(d) and (e) are micrographs of the crack growth path in SiC3D/Al composite
after the
experimental test. It is clearly seen that, before the primary crack was arrested, it propagated
along the SiC–Al
interface for some distance before bridging over the Al phase, in close agreement with the
numerical simulation..
Fig.10. Crack propagation in SiC3D/Al composite: (a) simulated
formation of
primary crack; (b) stress contours of the SiC3D/Al composite at t= 22.9 s from
simulation; (c)
simulated examples of cracking behavior along the SiC–Al interface; (d) micrograph showing crack
growth path during test; (e) micrograph showing crack bridging over the Al phase.
Experimental observation and numerical simulation of SiC3D /Al interpenetrating
phase
composite material subjected to a three-point bending load
Computational Materials Science 95 (2014) 408–413
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